Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Daeduck Electronics Developed Large Body FCBGA Substrate for Data Centers
June 26, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Established in 1965, Daeduck Electronics holds the distinction of being Korea's pioneering mass-producer of PCBs (Printed Circuit Boards), thus contributing significantly to the advancement of the nation's electronics sector for over six decades. With operations spanning five strategic locations, including four in Korea and one in Vietnam, coupled with its presence in key international markets through sales offices in the United States, China, and Taiwan, the company is poised for dynamic growth in tandem with the global package substrate market.
In recent years, Daeduck Electronics has strategically realigned its focus towards Semiconductor Package Substrates, marking a decisive entry into the FCBGA (Flip Chip Ball Grid Array) market through comprehensive investments commencing in 2021. This strategic movement has gained acclaim, positioning Daeduck Electronics as Korea's premier FCBGA manufacturer, underscored by tangible achievements and visible market impact.
FCBGA (Flip-chip Ball Grid Array) is a high-density semiconductor substrate that connects semiconductor chips and package substrates using the flip-chip method and improves electrical and thermal characteristics. Daeduck Electronics knocked the FCBGA market for AI servers and data centers, which was previously dominated by global peer companies in Japan and Taiwan.
Daeduck Electronics' large body FCBGA substrate is a state-of-the-art substrate with a size of 100mm x 100mm, with 20 or more layers, and is applied to high-performance computing (HPC) chips, which are commonly known as data center chips. Daeduck Electronics' large body FCBGA substrate can also be applied to CPUs, GPUs, and 2.5D packages known as CoWoS (Chip on Wafer on Substrate) packaging used in AI (artificial intelligence) servers. In fact, it has acquired the technological capabilities to enter all product markets that can be entered through FCBGA.
In addition, the company is preparing for another challenge in the next-generation packaging market by developing a technology that integrates silicon capacitor embedding technology, bridge integration technology, and large body FCBGA substrate technology.
"As semiconductor technology advances rapidly, we will focus on expanding our market share in next-generation markets such as AI and autonomous driving through collaboration with global major companies based on our differentiated cutting-edge technology," said Young-Joo KO, CTO Daeduck Electronics.
Share on:
Suggested Items
Kitron Reports Strengthening Momentum in Q2 2025
07/10/2025 | KitronKitron reported solid quarterly sales and profits, particularly driven by the Defence & Aerospace market sector.
Seeing a Future in Mexico
07/09/2025 | Michelle Te, I-Connect007The Global Electronics Association (formerly known as IPC) has been instrumental in fostering a partnership with Guanajuato, a state north of Mexico City with 12 industrial clusters and close to 150 companies involved in electronics. This past spring, Alejandro Hernández, the undersecretary for investment promotion in Guanajuato, attended IPC APEX EXPO 2025 at the invitation of IPC Mexico Director Lorena Villanueva, where he met with several companies to discuss the opportunities available in Mexico. He is inviting electronics-related companies seeking long-term investment in a centrally located area with access to highways, railways, and ports.
Webinar Review: A Global Trade and Economy in Flux
07/09/2025 | I-Connect007 Editorial TeamIn a July 8 webinar, Global Electronics Association Chief Economist Shawn DuBravac provided a comprehensive analysis of the evolving international trade environment, its implications for inflation, monetary policy, and labor dynamics, and a sober assessment of market valuations. In “Navigating a Shifting Landscape” DuBravac painted a picture of a global economy in flux, where shifting trade alliances and tariff structures are redrawing the supply chain map and influencing the broader economic landscape, while also conveying an overall bullish market outlook.
Arrow Electronics Launches Engineering Solutions Center to Support Tech Innovation Across India and Southeast Asia
07/09/2025 | Arrow ElectronicsArrow Electronics, a global provider of technology solutions, announced the launch of its new Engineering Solutions Center(ESC) in Bangalore, India.
LITEON Technology Reports Consolidated June Sales of NT$13.6 Billion, Up 16% Y-o-Y
07/08/2025 | LITEON TechnologyLITEON Technology reported its June consolidated revenue of NT$13.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 2% M-o-M, 16% Y-o-Y. The cumulative sales for January to June totaled NT$76.8 billion, up 24%, Y-o-Y.