-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueMaterial Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
The Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
IPC White Paper Emphasizes the Critical Importance of ‘Design for Excellence’ Throughout the Full Ecosystem of Electronics Design
June 27, 2024 | IPCEstimated reading time: 1 minute
A new white paper from IPC’s Chief Technologist (CTC) and Design Leadership (DLC) Councils, Better Electronics by Design: Next Generation Design Needs explores the elements of the “Design for Excellence” methodology, re-thinking how it needs to be further defined and applied in the full ecosystem of electronics design.
In addition, the whitepaper provides a high-level exploration of the full “silicon-to-systems” ecosystem, examines the justification and implications of an Authoritative Source of Truth (ASOT), discusses the need for synergy between building blocks of electronic systems, and takes a deep dive into the subject of design rules and “design for manufacturability.”
Key messages within the white paper include:
- Electronic systems are increasingly complex and heterogeneous.
- Facilitation of an Authoritative Source of Truth (ASOT) is mandatory to ensure consistency, efficiency, and traceability.
- The industry needs a more robust and interoperable toolset to support greater silicon-to-systems collaboration.
- Diverse electronic and mechanical CAD systems must gain interoperability by including proper model-based definitions (MBD) and collaborative software to cover both disciplines.
- A shift towards true digital collaboration and automation and an early consideration of manufacturing capabilities across the development process is essential to master increasing time-to-market and complexity challenges.
“Creating better electronics by design is a common, collective goal of the electronics industry,” said Peter Tranitz, IPC senior director, technology solutions, and leader of IPC’s design initiative “To achieve this, an ASOT should be established and protocols,
standardized. To leverage the associated benefits, a culture of real digital collaboration, transparency, and accountability needs to be established. Tools need to support bi-directional, incremental exchange of information. And, design rules need to be broken down to the relevant stages of the design workflow and checks need to be performed after every stage of the design process to drive the concept of ‘shift left.’ For effective Design for Manufacturability execution, manufacturers need to provide clear guidance on manufacturing capabilities and constraints to designers.”
Download the report: https://go.ipc.org/next-gen-design.
Suggested Items
Cadence Partners with GSME to Further Semiconductor Industry Growth in Oman
06/28/2024 | Cadence Design Systems, Inc.The global semiconductor supply chain is undergoing a profound transformation driven by several disruptive factors.
Freedom CAD Ready for Future With New Leadership
06/27/2024 | Andy Shaughnessy, Design007 MagazineDuring PCB East, I caught up with our friend Scott Miller of Freedom CAD. Scott has been chief operating officer of the company for quite a while, but he recently assumed a new title as new, younger managers moved up into top leadership positions. I asked Scott to discuss his new role, as well as the company’s move to keep looking at the industry in novel, fresh ways.
Bridging the Gap: Re-engaging Design and Manufacturing with Downstream
06/27/2024 | Andy Shaughnessy, Design007 MagazineAt PCB East in Boxborough, Massachusetts, I caught up with Joe Clark, co-founder of DownStream Technologies. In this interview, Joe walks us through how we got into our current situation, with design, fab, and assembly functioning in separate silos, and how DownStream and the IPC-2581 data format can help bridge this gap. He also discusses what we lost by moving from the captive model, and what we stand to gain by knocking down the walls between design and manufacturing.
APCT Launches as AdvancedPCB, Combines Industry Leaders Under One Brand
06/27/2024 | PRNewswireAdvancedPCB, a leader in printed circuit board (PCB) design and manufacturing, announces its launch, combining Advanced Printed Circuit Technology (APCT), Advanced Circuits, Inc. (ACI), and San Diego PCB Design (SDPCB), into a next-generation PCB manufacturer.
Siemens Debuts Fast, Accurate and Context-aware Electrostatic Discharge Verification Solution Spanning all Phases of IC Design
06/26/2024 | SiemensSiemens Digital Industries Software announced today a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.