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Spotlight on PEDC: Filbert Arzola 

12/19/2024 | Andy Shaughnessy, Design007 Magazine
IPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.

Altix Joins the MGI Digital Technology Group

12/10/2024 | ALTIX
Altix announces its merger with MGI Digital Technology, a strategic alliance with strong synergies, officially sealed on September 30, 2024.

Betamek Berhad Secures MYR 396,420 Government Grant for Digital Transformation

11/27/2024 | Betamek
Betamek Berhad has accepted a government grant of MYR 396,420 from the Ministry of Entrepreneur and Cooperatives Development, managed by Malaysia Industrial Development Finance Berhad.

Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award

11/26/2024 | Koh Young
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, is proud to announce that Foxconn honored us on November 15, 2024, with its prestigious 2024 Digital Ecosystem Partner Award.

Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association

11/22/2024 | SIA
The Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
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