Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025

01/15/2025 | ELMOTEC
E-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.

SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025

01/08/2025 | SolderKing Assembly Materials Ltd,
SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.

IPC Announces UK Regional Qualification for Hand Soldering Competition

01/02/2025 | IPC
IPC  invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5

12/23/2024 | I-Connect007 Editorial Team
Chapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in