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The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs

01/24/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce the launch of its newest venture, The Training Connection, LLC, a company dedicated to addressing the growing need for practical and effective training in test engineering and development. With a focus on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection is poised to empower professionals with the tools and expertise they need to excel.

Course Review: IPC’s New Semiconductor Course Provides a Thorough Layman’s View

01/22/2025 | Nyron Rouse, IPC
Taking the course, A Technical Overview of the Semiconductor CHIP Industry by Cheah Soo Lan wasn’t just a professional box to check for me; it was an opportunity to understand the technical backbone of a field that directly influences the work I do at IPC. While I’m not immersed in the technical aspects of semiconductors day to day, learning about this landscape allows me to better align our funding pursuits with the strategic needs of the industry.

Intervala Employees Advance Skills and Careers with Electronics Technician Training Program

01/16/2025 | Intervala
Intervala celebrated the recent graduates of its electronics technician training program. The program, developed in coordination with Westmoreland County Community College, is designed to enhance the skills and career development of Intervala's technicians.

IPC Announces New Training Course: PCB Design for Manufacturability

01/10/2025 | IPC
This three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.

SMTA Announces Wafer-Level Packaging Symposium Program

01/08/2025 | SMTA
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
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