Winners of the IPC Hand Soldering and Rework Competition Malaysia at Electronics Manufacturing Expo Asia (EMAX) 2024 Announced
July 29, 2024 | IPCEstimated reading time: 1 minute
In conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.
Skilled contestants competed against each other to rework a functional electronics assembly within a 50-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.
On the winner’s podium at EMAX 2024 were:
- First Place: Pubalan Sivasangkar, Cytron Technologies Sdn Bhd. As the winner, Sivasangkar qualified for the IPC Hand Soldering World Championship in Germany in November 2024.
- The top two runners-up came from the same company, Jabil Circuit Sdn Bhd. Second place this year went to Hasrol Mizam Bin Hassan. Norishah Binti Othman took third place.
IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year.
- Premier Sponsor: JBC
- Gold Sponsor: SOLDERINDO
- Supporting Sponsor: BTE
- Co-Organizer: NRG Exhibitions
For more information on upcoming hand soldering and rework competitions, contact Henry Ton, senior business development manager, Southeast Asia, at HenryTon@ipc.org.
Suggested Items
Pudu Robotics' PUDU T300 Achieves CE-MD and CE-RED Certifications, Empowering Global Smart Manufacturing with International Safety Standards
03/14/2025 | PRNewswirePudu Robotics, a global leader in service robotics sector, announced its innovative industrial delivery robot, the PUDU T300, has obtained both the CE-MD (Machinery Directive) and CE-RED (Radio Equipment Directive) certificates by TÜV SÜD, a world-renowned testing and certification organization.
DELO Releases IBOA-free Medical Adhesive for Glucose Monitoring Sensors and Other Wearables
03/14/2025 | DELODELO has released a new light-curing medical-grade adhesive engineered with nontoxicity in mind. DELO PHOTOBOND MG4047 is designed for wearable medical applications such as glucose monitoring sensors (CGM). Its chemical properties and impermeable characteristics help prevent skin irritation in cases of media influence such as rain or sweat.Teaser
Collins Aerospace Approved to Begin Full Rate Production of MAPS Gen II system
03/13/2025 | Collins AerospaceCollins Aerospace, an RTX business, has received approval for Full Rate Production of the Mounted Assured Positioning, Navigation and Timing (PNT) Generation II system (MAPS GEN II).
Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.