Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Strategic Materials Conference 2024 to Explore Semiconductor Innovations Shaping the Future of Electronics and AI’s Impact
July 31, 2024 | SEMIEstimated reading time: Less than a minute
With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2024) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials September 30-October 2 at the Hayes Mansion in San Jose, California. Registration is open.
SMC is the industry’s premier event focused on drivers of advanced materials, highlighting opportunities for key materials across the electronics supply chain in growth markets including computing and data storage, wireless communication, automotive, consumer and industrial electronics.
Themed Materials Revolution: Shaping the Future of Electronics and Beyond and the Impact of AI , SMC 2024 will feature the following key sessions:
- AI Enabling Faster Semiconductor Materials Innovation
- AI–Driven Heterogeneous Integration + Chiplet Technology
- Market Geopolitical, and Economic Trends
- Materials Scaling, Yield, and Metrology Challenges
- Sustainability Materials Challenges—PFAS
- Executive Panel: Strengthening Supply Chain for Industry Growth
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).