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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing

10/14/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

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American Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.

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Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025

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Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International

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