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Laser Photonics Propels R&D Efforts in PCB Depaneling

01/01/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.

WiSA Technologies Inks Definitive Agreement to Acquire CompuSystems

12/30/2024 | BUSINESS WIRE
WiSA Technologies, Inc., which anticipates closing its acquisition of Datavault® intellectual property and information technology assets of privately held Data Vault Holdings Inc.® and changing its name to Datavault Inc. on or about December 31, 2024, has entered into a Definitive Agreement to acquire privately held CompuSystems, Inc. (CSI).

WiSA Technologies Inks Definitive Agreement to Acquire CompuSystems

12/27/2024 | BUSINESS WIRE
WiSA Technologies, Inc., which anticipates closing its acquisition of Datavault® intellectual property and information technology assets of privately held Data Vault Holdings Inc.® and changing its name to Datavault Inc.

Solar Powered Aircraft Achieves New Stratospheric Success

12/26/2024 | BAE Systems
A British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession. 

Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
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