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DuPont Earns Silver Medal from EcoVadis for Sustainability Performance

03/28/2025 | PRNewswire
DuPont announced it has received the Silver Medal from EcoVadis, a global leader in sustainability assessments, in recognition of the company's continued advancement and progress on its sustainability performance.

Xanadu, Corning Sign Collaboration Agreement to Advance Fibre Interconnects for Photonic Quantum Computing

03/26/2025 | PRNewswire
Xanadu, a leading photonic quantum computing company, and Corning Incorporated, the global leader in fibre, cable and connectivity, will collaborate to develop customized fibre and fibre-array solutions to enable low-loss networking of photonic quantum computing chips.

Smartkem Signs Memorandum of Understanding with RiTdisplay to Integrate Smartkem's OTFT Process Into Its Gen2.5 Line

03/24/2025 | PRNewswire
Smartkem, which is seeking to change the world of electronics with a new class of transistor technology, has announced a memorandum of understanding with RiTdisplay Corporation, a leading developer of optoelectronic solutions, visual displays and passive-matrix OLED displays, to evaluate the integration of Smartkem's organic thin-film transistor (OTFT) process on RiTdisplay's Gen2.5 pilot line to expand Smartkem's product prototyping capability.

Breaking Down Barriers: Key Insights from John Mitchell’s Keynote

03/24/2025 | Brittany Martin, I-Connect007
At the core of IPC President and CEO John Mitchell’s keynote at IPC APEX EXPO on March 19, 2025, was a compelling message: electronics drive innovation, but true progress is powered by collaboration. In delivering his keynote, Mitchell challenged industry leaders in attendance with a crucial question, “How can we strike a balance between the growing push for protectionism and the undeniable need for global cooperation?”

Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

03/24/2025 | Zuken
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.
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