Flexible Thinking: Integrated Passive Devices—Design Solutions With Many Benefits
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBsiNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series
September 19, 2024 | iNEMIEstimated reading time: 1 minute
The International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes. This session, scheduled for Tuesday, September 24, 2024, will feature guest speaker Dr. Kazuhiro Nogita from the Nihon Superior Centre for the Manufacture of Electronic Materials.
With the increasing demand for high-power devices and applications requiring high-temperature interconnections, this webinar provides an essential overview of how TLP bonding can be utilized to enhance the reliability of SnCu solder systems. The discussion will focus on advances in lead-free Sn-based alloy systems, particularly tin-copper (SnCu), widely recognized for its cost-effectiveness, good fluidity, and low defect rates.
Dr. Nogita will draw from his extensive research to explain how TLP bonding can address the challenges posed by high-power density and miniaturization in electronics. This process makes it possible to achieve strong and reliable connections in demanding high-temperature environments.
About the Speaker
Dr. Kazuhiro Nogita is the founding director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM). He is also project manager of the University of Queensland – Kyushu University Oceania project (UQ-KU project) and Deputy Chair of the International Development and Engagement Committee at the School of Mechanical and Mining Engineering. His research is in three major areas: lead-free solders and interconnect materials, energy materials such as hydrogen-storage alloys, and structural and coating alloy development.
Registration:
This webinar is open to industry; advance registration is required, visit iNEMI's website.
Tuesday, September 24, 2024
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on Monday, September 23
Share on:
Suggested Items
Vuzix Receives $10 Million First Tranche Investment from Quanta Computer
09/16/2024 | PRNewswireVuzix® Corporation, a leading supplier of smart glasses and Augmented Reality (AR) technology and products, is pleased to announce that it has completed the closing of the first investment tranche, for the sale of $10 million in common stock at $1.30 per share, under its previously announced September 3, 2024 purchase agreement with Quanta Computer Inc.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/13/2024 | Marcy LaRont, PCB007 MagazineAt the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.
SigmaTron Regains Compliance with Nasdaq Listing Rule 5250
09/13/2024 | Globe NewswireSigmaTron International, Inc., an electronic manufacturing services company), announced today that on September 10, 2024, it received notice from the Listing Qualifications Department of the Nasdaq Stock Market LLC.
American Standard Circuits to Exhibit at European Microwave Week 2024
09/09/2024 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits announced that his company will be exhibiting at European Microwave Week 2024 to be held at the Paris Convention Center in Paris, France from September 22 through September 27, 2024.
iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
09/09/2024 | iNEMIiNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.