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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands
September 25, 2024 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands for environmentally conscious practices.
Building on their expertise in adaptive SMT equipment, Essemtec has designed a cutting-edge BGA re-balling process that consolidates flux deposition, ball placement, and soldering into a single streamlined solution. This all-in-one approach is particularly advantageous for high-volume OEMs and companies in sectors such as military, aerospace, computing, and communication, providing a cost-effective and sustainable method for component recovery and reuse.
Jiri Kucera, Operations Director at Altus Group, said: "Reworking BGAs, recovery of expensive parts, and re-use is becoming a highly discussed topic across the electronics industry as consumers become more interested in sustainability. This is another example of Essemtec developing a process to meet the needs of the market."
The new robotic process offers several advantages over traditional manual methods:
1. Increased precision and reliability.
2. Support for various ball sizes (250 µm to 1 mm+) and materials.
3. Improved success rates compared to manual stencil techniques.
4. Cost-effective reuse of expensive BGA components.
Jiri added, "Companies are already using the Essemtec jetting unit for BGA re-balling across a range of pitched components, giving partners the power to bring some of the recovery processes back in-house rather than outsource to partners at a higher cost."
This solution is particularly relevant for organisations prioritising environmental impact and sustainability. By extending the lifecycle of electronic components, the process contributes to waste reduction and promotes a more circular economy in electronics manufacturing.
Altus sees this technology as a significant step in meeting the electronic industry's evolving needs. As sustainability continues to gain importance, solutions like this will play a crucial role in shaping the future of electronics manufacturing and repair.
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Inner Layer Precision & Yields Explored in December 2024 Issue of PCB007 Magazine
12/16/2024 | I-Connect007 Editorial TeamBuilding accuracy into your inner layers as well as being able to assess their pass/fail status as early as possible is critical. In this month’s PCB007 Magazine, we take a close look at building precision into your inner layers.