Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

KIC Launches Game-Changing TAS Software Platform to Address Emerging Thermal Process Challenges

11/14/2024 | KIC
KIC, the leader in smart thermal process technologies for electronics manufacturing, announces the launch of its TAS Software (Thermal Analysis System Software), an advanced solution designed to tackle new industry challenges and provide fresh opportunities in thermal profiling.

ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland

11/13/2024 | ITW EAE
ITW EAE, announces a new partnership agreement with Etek Europe to further expand its representation and distribution network. Under this agreement, Etek Europe will represent Despatch products in the United Kingdom and Ireland. 

DuPont to Feature Innovative Electronics Products and Solutions at Electronica 2024

11/13/2024 | DuPont
As the demand for advanced technology surges, DuPont will be featuring its extensive portfolio of innovative products and solutions at Electronica 2024, the world’s premier trade fair for electronics, November 12-15 in Munich.

SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar

11/12/2024 | SMTA
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.

Aismalibar to Showcase Advanced Thermal Management Solutions for Electronics at electronica 2024

11/11/2024 | Aismalibar
Aismalibar, a leading innovator in thermal management solutions, will exhibit at electronica 2024, the world’s foremost trade fair and conference for the electronics industry, held in Munich from November 12-15, 2024. Located at Booth B1.543, Aismalibar will highlight its latest advancements in Thermal Interface Materials (TIMs), Insulated Metal Substrates (IMS), and Thermal FR4 solutions tailored to meet the increasing demands for efficient heat dissipation and durability across various high-power applications.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in