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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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STARTEAM GLOBAL Achieves ISO 14064 GHG Verification

06/05/2026 | STARTEAM GLOBAL
We are pleased to share that STARTEAM GLOBAL has successfully completed the ISO 14064 Greenhouse Gas (GHG) verification audit, conducted by BSI, with no outstanding nonconformities.

American Standard Circuits to Exhibit at IMS 2026 in Boston

06/02/2026 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits, has announced that the company will be exhibiting at IMS 2026, the world’s leading event for RF, microwave, and high-frequency technologies, taking place June 8th through June 13th, 2026, at the Thomas M. Menina Convention and Exhibition Center in Boston, Massachusetts.

Dow Launches DOWSIL TC-3120 Thermal Gel for Optimum Heat Transfer for Optical Modules, Dense Electronics and High-speed Data Applications

06/01/2026 | Dow
Dow has announced the launch of DOWSIL™ TC-3120 Thermal Gel, a silicone-based material designed to optimize heat transfers and provide optical-grade cleanliness. It has the highest thermal conductivity (~12 W/m·K) among Dow’s commercially available silicone gels and is designed to minimize oil bleeding and condensed outgassing – contaminants that can reduce the reliability of optics and electronics.

The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.

How New Metals Tariffs Impact the Electronics Industry

05/20/2026 | James Kim, Arentfox Schiff LLP
If you work in surface mount assembly, EMS, or anywhere along the electronics supply chain, you probably think of tariffs as something that happens upstream: raw materials, bulk commodities, maybe the occasional headache with Chinese imports. Steel and aluminum tariffs? That’s someone else’s problem. Not anymore. On April 2, President Trump signed a sweeping new proclamation that fundamentally restructures how Section 232 “national security” tariffs apply to steel, aluminum, copper, and their derivative products. The changes took effect on April 6, and the ripple effects are headed straight for the electronics industry.
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