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MIRTEC Celebrates 20 Year Milestone Anniversary

10/04/2024 | MIRTEC
MIRTEC Co., LTD, “The Global Leader in Inspection Technology,” proudly celebrates the 20th anniversary of its North American Sales and Service Division, MIRTEC Corp.

IPC Cyber Disaster Recovery Webinar: Essential Preparedness for Electronics Manufacturers

10/03/2024 | IPC
In today's fast-evolving electronics manufacturing landscape, where digital threats loom large, safeguarding operations requires more than just IT solutions—it demands full production line awareness.

Explore Advanced Coating Solutions for Electronics at SMTA International 2024

10/03/2024 | ECT
Engineers and electronics professionals attending SMTA International 2024 are invited to visit booth 2713, where Electronic Coating Technologies (ECT) will present solutions for protecting and enhancing the durability of electronic assemblies. In collaboration with Dymax.

IPC CEMAC 2024: Shaping Innovation and Driving Technological Transformation in Electronics Manufacturing

10/03/2024 | IPC
IPC CEMAC(China Electronics Manufacturing Annual Conference, as an exclusive annual event for members in the electronics manufacturing industry, aims to promote industry development and cooperation, facilitate the application and promotion of quality and technical standards in China's electronics manufacturing, and establish an efficient, professional, and high-value international exchange platform centered around IPC international industry standards.

Stringent High-speed Requirements Pose Technology Challenges

10/03/2024 | Tarja Rapala and Joe Beers, iNEMI
The ever-increasing demands on printed circuit boards to satisfy the needs of tomorrow’s products means that PCB manufacturers must continuously evolve and react to a wide variety of technological and market requirements such as: Functional density: Finer features, higher density, and increased layers; signal integrity: Higher frequencies, driven by higher data transfer speeds and increased data needs; material properties refinement: Must meet performance as well as environmental demands; Smart manufacturing: Automation, robotics, artificial intelligence, augmented and virtual reality, and machine learning are all part of the future PCB manufacturing floor; and time-to-market: Increased urgency to facilitate new design implementation, product introduction and qualification, quicker market differentiation, and survival.
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