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Smiths Detection Awarded Service Subcontract

10/10/2024 | BUSINESS WIRE
Smiths Detection, a global leader in threat detection and security screening technologies, announces it has been awarded a seven year contract to support TechFlow’s Integrated Logistics Support Contract with the Transportation Security Administration (TSA) to service hold baggage X-ray inspection systems at airports across the United States.

The SD11 Inkjet Printer and Ventec Giga Solutions

10/10/2024 | Marcy LaRont, PCB007 Magazine
Ventec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.

Intel Celebrates AI Innovations by Students with Global Impact Festival

10/10/2024 | Intel
Intel announced the global prize winners at its fourth-annual AI Global Impact Festival. The festival celebrates student-led AI projects from 25 countries that address community issues and align with UN Sustainable Development Goals using Intel technologies.

SolderKing Celebrates a Milestone of Growth and Innovation in Soldering Solutions

10/10/2024 | SolderKing Assembly Materials Ltd,
SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating six years of growth and success in the electronics and industrial manufacturing sectors.

Buyers Focus on Inventory Reduction; Slowing Demand Growth Constrains Q4 Memory Price Increases

10/10/2024 | TrendForce
TrendForce’s latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.
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