-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Easy-PC Celebrates 40 Years of Excellence in PCB Design with the Addition of Over 40 New Features
October 15, 2024 | Easy-PCEstimated reading time: 1 minute
Number One Systems, a technology-leading PCB design solution company, celebrates 40 years of success with the release of its latest update, Easy-PC™ Version 28, featuring more than 40 new enhancements.
“Since its early DOS versions, Easy-PC has been at the forefront of innovation in PCB design, consistently adapting to user needs while remaining accessible to designers of all skill levels,” said Fiona Colman, Marketing Manager at Number One Systems. “In this year's release of Easy-PC, we have focused on five main areas of the product, all driven by feedback from our users: Application Enhancements, Library Management and Creation, Designing and Editing, Design Checking and Integrity, and Plotting and Manufacturing. Each area contains a wealth of new features aimed at improving productivity and streamlining the design process, ensuring that users can continue creating innovative designs with ease.”
New in Version 28, a Few Highlights:
- Application Enhancements: The updated user interface includes a new 'flat' look, improved toolbars, and the addition of a Utilities menu to simplify the design experience and increase productivity.
- Library Management and Creation: Enhanced tools for library creation and editing now include support for .epl format files, improved symbol editing, and access to over 15 million ready-to-use components.
- Design and Editing: Powerful new features like flip vertical mode, rotate around center, and text cutout creation for copper layers make designing faster and more intuitive.
- Design Checking and Integrity: Upgraded geometry checks and a reorganized DRC dialog ensure more accurate and stable designs.
- Plotting and Manufacturing: New tools for drill ident creation, automatic plot generation, and enhanced via handling allow for more seamless manufacturing.
Designers using Version 28 will benefit from full compatibility with the latest versions of Windows (10 and 11), access to over 15 million components through the Component Search Engine and over 10 million components via SnapMagic, continued support from a dedicated technical team, and access to supplementary component libraries.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
IBM, Dallara to Advance AI and Quantum-Powered Design for High-Performance Vehicles
05/01/2026 | IBMIBM and the Dallara Group, a world-leading racing and high-performance vehicle manufacturer, announced a collaboration to advance vehicle design and optimization using AI and explore the use of quantum computing.
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.