The Marketing Minute: Staying Positive When the Market Isn’t
Marcy’s Musings: Continuing to Invent the Future With SEL
It’s Only Common Sense: Why Failure Is an Opportunity for Growth
Avnet Announces Release of Autodesk Fusion Integration
October 16, 2024 | AvnetEstimated reading time: Less than a minute
Design engineers can now access thousands of reference design schematics, lead time and pricing trends, and fast alternate guidance with the launch of the Avnet App, an add-in for Autodesk Fusion.
Avnet is the first to add these design capabilities and insights via a globally available add-in to the Autodesk Fusion solution. The Avnet App will give design engineers access to a powerful part search, alternates library, project cost and supply chain health analysis, datasheets, component symbols and more.
Autodesk Fusion is a cloud-based 3D modeling, CAD, CAM, PCB and mechanical engineering solution for product design and manufacturing. Avnet’s new features are offered as a Fusion add-in to streamline design workflow, helping design engineers meet functional requirements, cost targets, manufacturing goals, and lifecycle timelines.
“As a key technology partner in the early stages of design and product realization, Avnet provides engineers with valuable tools through the app,” said Chris Jackson, VP, Digital Strategy and Innovation, Avnet. “The reference design library is full of schematics and project descriptions that engineers can directly place into their designs with a simple in-app search in as few as three clicks.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/21/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
08/19/2025 | Happy Holden -- Column: Happy’s Tech TalkWith the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.