AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum

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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

In addition, AIM Product Manager, Diego Jiang will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments:

High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue.​ Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA South China Expo & Tech Forum November 6-7.