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Koh Young Technology Showcasing its Inspection Solutions at NEPCON ASIA in Shenzhen
November 6, 2024 |Estimated reading time: 2 minutes
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, demonstrates its award-winning inspection solutions at NEPCON Asia from November 6-8, 2024, in booth 9E10 at the Shenzhen World Exhibition & Convention Center. With a focus on innovative technologies and advanced solutions for circuit board assembly, semiconductor packaging, and smart factories, our engineers will demonstrate solutions to solve your challenges.
Koh Young experts will demonstrate how our Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and Dispensed Material Inspection (DPI) solutions can enhance your production quality and yield, especially when combined with our KSMART software solutions like KPO, KAP, and Smart Review. We will be highlighting several systems uniquely positioned to provide solutions for challenges from circuit board assembly to advanced package and semiconductor inspection:
Zenith Nova The new Zenith Nova is a True 3D AOI Solution powered by artificial intelligence and machine learning, combining the best mechatronics and algorithm technologies to deliver outstanding performance without sacrificing accuracy.
KY8030 Nova Delivering an ideal mix of cost and performance for solder paste inspection, the new KY8030 Nova provides the best value for a varied set of application needs demanding enhanced quality, increased productivity, and better operational efficiency.
Neptune C+ Protect your electronics with confidence. Koh Young’s patented L.I.F.T. technology (Laser Interferometry for Fluid Tomography) ensures precise, non-destructive 3D inspection of conformal coatings and other dispensed materials, whether wet or dry.
Meister S Qualified by leading semiconductor foundries and Mini/Micro-LED companies, the Meister S delivers full 3D inspection for micro solder and flux inspection applications, combining high-resolution optics with innovative vision algorithms.
Meister D+ Breakthrough True 3D inspection technology for high-density substrates and highly reflective components. The Meister D+ leverages Koh Young’s new proprietary optics and Moiré technology to achieve accurate 3D inspection of mirror-finish reflective dies and challenging surfaces.
KSMART Maximizing production efficiency by combining industry standards with AI engines to go beyond simple machine connectivity and open the gates to a smart factory to everyone.
KPO (Koh Young Process Optimization) Based on Koh Young’s accurate True 3D measurement data and its proprietary deep learning technology, KPO analyzes defects and enables real-time process optimization.
KAP (Koh Young Auto-Programming) Industry-leading 3D profilometry technology converges with Koh Young’s proprietary AI technology to deliver true automatic programming. The innovative geometry-based Koh Young Auto Programming (KAP) software solution reduces the programming process to minimize production preparation and reduces costs.
Smart Review Combining proprietary vision algorithms with a learning-based AI engine from Koh Young, the Smart Review system reduces false calls and operator intervention by automatically assessing OCV and OCR readings. By minimizing false calls, the Smart Review system increases line operator efficiency and boost production line utilization to reduce overall costs. The system also maximizes production performance by reviewing defects from multiple lines, offering judgment history and the help cards with auto-classified defect information.
For more information about how Koh Young’s award-winning solutions can elevate your production quality and solve your most challenging inspection needs, visit us at NEPCON Aisa Booth A3.358 or SEMICON Europa Booth C2.549. Do not miss this opportunity to engage with our experts, experience our innovative technologies firsthand, and discover how we can help you achieve new levels of efficiency in your manufacturing processes.
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