Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

NEOTech Significantly Improves Wire Bond Pull Test Process

11/25/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.

Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management

11/25/2024 | Anaya Vardya -- Column: Standard of Excellence
In continuing my series on finding, signing, and keeping good people for your company, this month we discuss hiring good people for your quality department. Even when hiring was easier, hiring for the quality department has always been especially challenging. It takes a special kind of person: someone with attention to detail, someone ready to stand for his or her convictions, and someone who can stand up under pressure when the company needs to ship product and the quality manager refuses to because it is not up to par. The quality department is the very soul of any manufacturing company.

China Overtakes Germany and Japan in Robot Density

11/22/2024 | IFR
China's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.

PCB Design Software Market Expected to Hit $9.2B by 2031

11/21/2024 | openPR
This report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.

SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute

11/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in