Koh Young Technology Showcasing Advanced Packaging Inspection Solutionsat SEMICON Japan

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Koh Young Technology, y, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024. Our team of experts will be on hand to discuss how our inspection solutions can boost quality and increase yield for advanced and wafer-level packaging. Our team of inspection experts will highlight three different machines: Meister S, Meister D+, and ZenStar.

Meanwhile, at SEMICON Europa Booth C2.549, we will showcase inspection technologies specifically designed for semiconductor and advanced packaging applications, including wafer-level packaging solutions. Our team of inspection experts will highlight three different machines, including:

Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits. The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.

Meister D+ The Meister D+ combines industry-leading Moiré technology and Koh Young’s proprietary new optics to support 3D inspection of highly reflective dies, a long-term inspection challenge. Koh Young Technology leverages its expertise in 3D measurement and inspection to address the precise inspection of wafer surfaces, critical dimension measurement, defect detection, and the analysis of complex structures found in semiconductor devices.

ZenStar The ZenStar, making its debut at SEMICON Japan, supports True 3D inspection of highly

reflective dice with a mirror surface. Its unparalleled 2D/3D multi-modal technology combines industry-leading Moiré technology and new Koh Young proprietary optics to provide robust and stable inspection for bleeding-edge applications. With its proprietary deep learning technology, the ZenStar offers enhanced capabilities to inspect defect items like micro-cracks, foreign material, and chipping.