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IPC, FED Partner for New Design Conference in Vienna

12/12/2024 | Andy Shaughnessy, Design007 Magazine
IPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?

SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term

12/02/2024 | SEMI
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union to bolster its semiconductor ecosystem.

IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing

11/21/2024 | IPC
IPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.

Orbex Welcomes Contract Extension and Additional Funding from ESA’s Boost! Programme

11/19/2024 | Orbex
Leading orbital launch services company, Orbex has today welcomed the extension of its contract with the European Space Agency’s (ESA) Boost! Programme and additional funding of €5.6 million.

TI Accelerates Delivery to European Customers; Opens New Product Distribution Center Near Frankfurt, Germany

11/14/2024 | Texas Instruments
Texas Instruments (TI) announced the opening of its new, state-of-the-art product distribution center in Dreieich, Germany, outside of Frankfurt.
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