SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
December 11, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
The final incentives, part of the CHIPS and Science Act, solidify support for Micron’s memory chip production facilities in Idaho and New York. Additionally, the Commerce Department announced $275 million in preliminary incentives to expand Micron’s manufacturing facility in Manassas, Virginia, further accelerating semiconductor manufacturing capabilities in the U.S.
“These critical incentives underscore the transformative impact of the CHIPS and Science Act in driving domestic semiconductor production and innovation to ultimately enhance supply chain resilience and American competitiveness,” said Neuffer. “Memory is a technology critical to America’s economic future and national security, and Micron’s historic investments in producing memory chips in the U.S. will strengthen U.S. leadership for the long term. We commend Micron for its forward-looking investments in Idaho, New York, and Virginia, and we applaud the Department of Commerce for its steadfast commitment to strengthening America’s leadership in chip manufacturing. Together, these efforts will create high-paying American jobs, bolster U.S. national and economic security, and fuel innovation for years to come.”
The CHIPS Act has spurred significant investments across the domestic semiconductor industry, with more than 90 new projects announced in 28 U.S. states since its introduction, totaling hundreds of billions in private investments. These projects are expected to generate over 58,000 jobs directly within the semiconductor ecosystem and support hundreds of thousands of additional jobs throughout the U.S. economy.
The finalized incentives for Idaho and New York build upon a preliminary agreement announced in April 2024, while the new agreement for the Manassas expansion represents a pivotal step in advancing U.S. semiconductor manufacturing capacity.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.