SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
December 11, 2024 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
The final incentives, part of the CHIPS and Science Act, solidify support for Micron’s memory chip production facilities in Idaho and New York. Additionally, the Commerce Department announced $275 million in preliminary incentives to expand Micron’s manufacturing facility in Manassas, Virginia, further accelerating semiconductor manufacturing capabilities in the U.S.
“These critical incentives underscore the transformative impact of the CHIPS and Science Act in driving domestic semiconductor production and innovation to ultimately enhance supply chain resilience and American competitiveness,” said Neuffer. “Memory is a technology critical to America’s economic future and national security, and Micron’s historic investments in producing memory chips in the U.S. will strengthen U.S. leadership for the long term. We commend Micron for its forward-looking investments in Idaho, New York, and Virginia, and we applaud the Department of Commerce for its steadfast commitment to strengthening America’s leadership in chip manufacturing. Together, these efforts will create high-paying American jobs, bolster U.S. national and economic security, and fuel innovation for years to come.”
The CHIPS Act has spurred significant investments across the domestic semiconductor industry, with more than 90 new projects announced in 28 U.S. states since its introduction, totaling hundreds of billions in private investments. These projects are expected to generate over 58,000 jobs directly within the semiconductor ecosystem and support hundreds of thousands of additional jobs throughout the U.S. economy.
The finalized incentives for Idaho and New York build upon a preliminary agreement announced in April 2024, while the new agreement for the Manassas expansion represents a pivotal step in advancing U.S. semiconductor manufacturing capacity.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors
05/13/2026 | Michigan Tech Electronics HubThe energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.
Intel Foundry Push Gains Momentum With Apple as Potential Customer
05/13/2026 | I-Connect007 Editorial TeamApple’s reported decision to tap Intel as a manufacturing partner for future chips could mark one of the most significant shifts in the semiconductor supply chain in years, with implications that extend well beyond consumer electronics.
SEMI: Global Semiconductor Materials Market Revenue Reaches Record $73.2 Billion in 2025
05/13/2026 | SEMIGlobal semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported in its Materials Market Data Subscription (MMDS).
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.