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ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

12/13/2024 | ROHM
ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea.

TTM Technologies Introduces Innovative Radio Frequency Components for Telecom Band n104 to Enhance 5.5G Applications

12/12/2024 | Globe Newswire
TTM Technologies, Inc. has expanded its Radio Frequency and Specialty Components (RF&S) product offering by releasing a family of components supporting telecom band n104, an emerging band extension for 5.5G applications.

Saki Introduces Advanced X-Ray Inspection System for Next-Generation Miniaturized and Slim Power Modules

12/11/2024 | Saki Corp.
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of the 3Xi-M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series.

STMicroelectronics to Boost AI at the Edge with New NPU-Accelerated STM32 Microcontrollers

12/11/2024 | STMicroelectronics
STMicroelectronics, is making embedded artificial intelligence (AI) truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine-learning (ML) capabilities.

ASMPT: Innovative Bonding for Power Electronics

12/09/2024 | ASMPT
ASMPT presents with its SilverSAM™ SilverSAM machine a highlight for makers of modern power electronics: an innovative and versatile silver sintering machine that meets the great demands on bonding, which is particularly critical in the field of electromobility. SilverSAM sets new standards in interconnect technology for power electronics, particularly in the rapidly growing electric vehicle market.
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