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Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

12/13/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $225 million in proposed direct funding under the CHIPS and Science Act.

ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

12/13/2024 | ROHM
ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea.

Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects

12/12/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Micron Technology up to $6.165 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on April 25, 2024, and the completion of the Department’s due diligence.

SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects

12/11/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.

Sondrel Now Shipping Chips as Part of a Complete Turnkey Project

12/09/2024 | Sondrel
Sondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for AI, which is one of Sondrel’s speciality areas as it requires high performance, ultra-complex custom designs on leading edge nodes.
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