Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Nokia Announces Major Expansion of U.S. Semiconductor Advanced Test and Packaging in Pennsylvania to Bolster AI Growth

06/24/2026 | Nokia
Nokia announced a major expansion of its advanced test and packaging (ATP) operations in Allentown, Pennsylvania. The investment will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity across the United States.

SEMICON West 2026 to Spotlight Innovations Driving Semiconductor Industry Beyond $1 Trillion

06/24/2026 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced this year’s SEMICON® West will be held October 13-15 at Moscone Center in San Francisco.

Technica USA Returns to Capitol Hill to Advocate for Domestic PCB Manufacturing

06/22/2026 | Technica USA
Technica USA joined fellow members of the Printed Circuit Board Association of America (PCBAA) in Washington, D.C., for the Association’s Annual Meeting and advocacy events on Capitol Hill.

One Design, Many Minds: From Concurrent to Co-design

06/23/2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.

Safran, SatSure Partner to Advance GEOINT in India

06/22/2026 | Safran
As part of the France-India Year of Innovation, Safran Electronics & Defense and SatSure have signed a Memorandum of Understanding (MoU) to formalize their collaboration in Geospatial Intelligence (GEOINT).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in