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nVent SCHROFF Introduces Enhanced PCB Extraction in Rugged Environments

02/11/2025 | I-Connect007 Editorial Team
nVent SCHROFF plc has unveiled its latest innovation, the Positive Retraction Card-Lok, specifically engineered for the dependable removal of printed circuit boards (PCBs) in rugged environments, aerospace being chief among them.

DataRobot Acquires Agnostiq to Accelerate Agentic AI Application Development

02/11/2025 | BUSINESS WIRE
DataRobot, the provider of AI that makes business sense, announced it has acquired Agnostiq and its open-source distributed computing platform, Covalent. With this acquisition, DataRobot continues to accelerate agentic AI application development with advanced compute orchestration and optimization.

LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement

02/11/2025 | LQDX
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.

Keytronic Posts Results for Q2 FY 2025: New Program Wins; Cost Reduction Initiatives; Expansion Plans in US and Vietnam

02/11/2025 | Keytronic
For the second quarter of fiscal year 2025, Key Tronic reported total revenue of $113.9 million, compared to $147.8 million in the same period of fiscal year 2024.

Technica USA Announces New Relationship with PARMI USA in Multiple Markets

02/11/2025 | Technica USA
Technica USA announced today that they have entered in a Distribution/Representative relationship with PARMI USA. Working closely with the PARMI USA team, Technica will be responsible for the territories of CA, NV, OR, WA, ID, UT, AZ, NM, CO, WY, TX, OK, AR, & LA.
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