American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
AGC Multi Material to Showcase Substrate Materials at DesignCon 2025
December 31, 2024 | AGC Multi Material AmericaEstimated reading time: Less than a minute
AGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, California, Jan. 28-30, 2025.
Visit us at Booth 1238 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series.
DesignCon is the premier high-speed communications and system design conference and exposition.
Share on:
Suggested Items
BOOK EXCERPT: The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, Chapter 4
12/31/2024 | I-Connect007Bio-based encapsulation resins have the potential to contribute to sustainability targets by extending product lifetime and improving performance. The author explores the use of recycled materials such as biogenic waste and lightweight expandable polymers to create more efficient and environmentally friendly encapsulation resins.
Rogers Announces Addition of Woon Keat Moh to Board of Directors
12/23/2024 | Rogers CorporationRogers Corporation announced that Woon Keat Moh ("Moh") has been appointed as an independent member of the Company’s Board of Directors, effective January 1, 2025. Following this change, the Board will be composed of nine members, eight of whom are independent.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
Coherent Evaluates Strategic Alternatives for Its Advanced Lithium-Ion Battery Recycling Technology
12/13/2024 | Globe NewswireCoherent Corp., a global leader in materials, networking, and lasers, today announced that as a result of an ongoing strategic portfolio assessment, the company will evaluate strategic alternatives for its Streamlined Hydrometallurgical Advanced Recycling Process (SHARP™) technology to efficiently recover and recycle critical metals from lithium-ion batteries (LiBs).
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in