Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Tata Elxsi to Accelerate SDV Adoption With Qualcomm's Snapdragon Automotive Platforms
January 3, 2025 | PRNewswireEstimated reading time: 1 minute
Tata Elxsi, Inc. has announced its plans to work with Qualcomm Technologies, Inc. to develop and leverage virtual models of Snapdragon® Digital Chassis™ solutions for cloud-native application development. Through the intended technology collaboration, which will be demonstrated at the Consumer Electronics Show (CES) 2025, Tata Elxsi will develop a virtual electronic control unit (ECU) platform for automakers and Tier-1 suppliers using Snapdragon virtual system-on-chips (VSoCs) for the next generation of mobility solutions for passenger, commercial, and off-highway vehicle segments.
Tata Elxsi aims to utilize the Snapdragon Digital Chassis VSoCs to help revolutionize the Software-Defined Vehicle (SDV) development process, enabling R&D teams to accelerate software development and validation. By reducing the dependency on hardware availability, this initiative aims to streamline and speed up product development lifecycles, ensuring that advanced mobility solutions reach the market faster and more efficiently.
At CES 2025, Tata Elxsi will showcase this process using the company's AVENIR™ SDV suite of solutions integrated with Qualcomm Technologies' Snapdragon Ride™ Flex SoC. The demonstration will highlight real-world use cases, including mixed-critical workloads for infotainment and advanced driver assistance systems.
"Our planned work with Qualcomm Technologies reflects Tata Elxsi's leadership and investments in SDV technologies and the future of cloud-native automotive software development. Tata Elxsi's AVENIR suite with Snapdragon Digital Chassis solutions offer a high performance, scalable solution for automakers to realize next generation of SDVs. This unique combination of world-class software and system expertise, virtualised models and ready-to-adopt SDV software offers OEMs a compelling and future-ready path to SDVs and next generation mobility," said Shaju S, Vice President & Head of Transportation Business Unit, Tata Elxsi.
"Tata Elxsi's demonstration of enabling Snapdragon virtual SoCs for early development in a cloud-native environment leveraging their AVENIR SDV suite offers the developer community a cost effective, early access to target hardware and reduces time to market for new application development. Access to leading edge, high performance heterogeneous compute environment in the cloud truly enables the future of pre-and post-production approaches to software development. It also facilitates continuous updates of new features throughout the lifecycle of the vehicle, enabling our partners to deliver a rich experience to the end consumer and build new business models," said Laxmi Rayapudi, VP of Automotive Software Product Management, Qualcomm Technologies, Inc.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
The Road to Reliability: Why EV Electronics Matter More Than Ever
09/16/2025 | Stanton Rak, SF Rak CompanyThe global transition to e-Mobility is redefining the design and reliability expectations of automotive electronics. Unlike their internal combustion engine (ICE) counterparts, EVs operate under "always-on" conditions and are subject to higher voltages, higher currents, and elevated thermal loads. These systems also incorporate exponentially more sensors, control units, and advanced power electronics, often tightly packed in thermally constrained spaces.
Meet with The Test Connection Inc. (TTCI) at SMTA Guadalajara 2025
08/18/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce its participation at the upcoming SMTA Guadalajara Expo & Tech Forum, taking place September 17–18, 2025, at Expo Guadalajara, Salón Jalisco Hall D & E.
Amidst U.S. Strategy Shift, Foxconn Sells Lordstown, Ohio Plant for $88 Million
08/07/2025 | I-Connect007 Editorial TeamAs part of a strategic shift in its US operations, Taiwan-based Foxconn (Hon Hai Precision Industry’s) subsidiaries are selling off assets at its Lordstown, Ohio, facility, the company announced on Aug. 4.
FuriosaAI Closes $125M Investment Round to Scale Production of Next-Gen AI Inference Chip
07/31/2025 | BUSINESS WIREFuriosaAI, a semiconductor company building a new foundation for AI compute, today announced it has completed a $125 million Series C bridge funding round. The investment continues a period of significant momentum for Furiosa as global demand for high-performance, efficient AI infrastructure soars.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.