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UNIST Signs Strategic Partnership with Microsoft Korea to Accelerate AI-Driven Digital Transformation

06/16/2025 | UNIST
UNIST signed a strategic partnership agreement with Microsoft Korea at the university’s Main Administration Building. The partnership aims to actively incorporate AI technologies into practical applications and to advance university-specific digital transformation initiatives.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

05/29/2025 | Amphenol Printed Circuits
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.

Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems

05/27/2025 | Imec
At the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.

Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP

05/19/2025 | Electroninks
Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications.

Join the Conversation: MESI 4.0 Summit 2025

05/15/2025 | Critical Manufacturing
The MES and Industry 4.0 International Summit 2025 (MESI 4.0 Summit), hosted by Critical Manufacturing, will bring together manufacturing leaders, technology experts, and industry pioneers in Porto on June 12-13, offering a unique platform to explore practical strategies for digital transformation and smart manufacturing.
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