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Growth and Innovation at FCT

02/26/2025 | Marcy LaRont, I-Connect007
During DesignCon, I met with Tony Plemel, senior applications engineer at Flexible Circuit Technologies (FCT), to discusses the company’s growth and expansion opportunities, including its expansion of its inTFlex EMS facility. In this interview, Tony explains how FCT’s commitment to customer service and focus on communication and responsiveness allow the company to leverage its capabilities for continued expansion.

Flexible Circuit Technologies Announces Major Expansion of Capabilities & Resources

11/13/2024 | CNW
Flexible Circuit Technologies (FCT), a global design and value add manufacturer of flexible circuits, heaters, and membrane switches based in Minneapolis, MN, announces the opening of FCT-Huizhou.

TRI Wins Two EM Asia Innovation Awards for AOI and ICT

07/08/2020 | TRI
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announces that it was awarded two 2020 EM Asia Innovation Awards in two categories.

Step Stencil Technologies and Their Effect on the SMT Printing Process

12/21/2017 | Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT Assembly
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.

December Issue of SMT Magazine Available Now

12/04/2017 | I-Connect007
The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.
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