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EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI Automated Production Wafer Bonding System

03/18/2025 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation version of its GEMINI® automated production wafer bonding system for 300-mm wafers.

epoxySet Launches UV-8675 – Deep Section, UV Cured Adhesive for PVC

02/19/2025 | epoxySet
epoxySet   introduces the UV-8675, acrylated urethane adhesive for bonding PVC, polycarbonate and most other plastics.  Designed for bonding PVC tubing in medical devices, it also bonds well to glass and metals. This semirigid polymer offers high bond strength without causing stress cracks. 

KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop

01/22/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview.

EpoxySet to Exhibit at MD&M West

12/05/2024 | epoxySet
EpoxySet Inc. will be exhibiting at MD&M West on February 4-6, 2025 in the Anaheim Convention Center, booth 617.

ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield

12/02/2024 | ZESTRON
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield” 
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