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GlobalFoundries Announces New York Advanced Packaging and Photonics Center

01/24/2025 | GlobalFoundries
GlobalFoundries (GF) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.

Cadence to Acquire Secure-IC, a Leader in Embedded Security IP

01/22/2025 | Cadence Design Systems
Cadence announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider.

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

01/09/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.

Hon Hai Research Institute Publishes AI-Driven Silicon Carbide Technology in IEEE OJPEL

01/01/2025 | Hon Hai Technology Group
Hon Hai Technology Group announced that its Semiconductor Research Institute has successfully combined AI learning models with reinforcement learning to accelerate the research and development of silicon carbide power semiconductors.

Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers

12/18/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co., Ltd. (GlobalWafers), of up to $406 million under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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