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Ericsson, Nokia, ANDREW, and Huawei Take Top Spots in ABI Research’s DAS/DRS Vendors Competitive Ranking

05/07/2025 | ABI Research
Driven by the growing demand for seamless connectivity and 5G readiness, the Distributed Antenna System (DAS) and Distributed Radio System (DRS) market is shifting toward more intelligent, scalable solutions tailored to diverse enterprise environments.

ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies

05/06/2025 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.

SMTA Announces New Online Training Course on Workplace Professionalism

05/06/2025 | SMTA
The SMTA is excited to announce a new online training course titled “A Guide to Workplace Professionalism” which is now available with complimentary access for all SMTA members.

Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics

05/07/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.

Happy’s Tech Talk #38: Novel Metallization for UHDI

05/07/2025 | Happy Holden -- Column: Happy’s Tech Talk
I have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
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