It’s Only Common Sense: Why Sales Teams Fail (and How to Fix Them)
The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Teledyne FLIR Defense Awarded $74 Million IDIQ Contract to Modernize U.S. Coast Guard Surveillance Systems
January 13, 2025 | BUSINESS WIREEstimated reading time: 1 minute
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced it has been awarded a five-year Indefinite Delivery Indefinite Quantity (IDIQ) contract worth up to $74.2 million to provide modernized imaging surveillance systems to the United States Coast Guard (USCG).
FLIR Defense will deliver more than 125 Electro-Optic Sensor System-Modernized (ESS-M) systems for use on USCG rotary wing aircraft, specifically the MH-60 and MH-65. The advanced ESS-M platform features a full-HD sensor suite and updated user interfaces, as well as advanced processing capabilities and software enhancements that will support future growth.
The ESS-M systems provide operators with high-definition daylight, low light, and infrared imagery and will be used in support of all Coast Guard missions, with an emphasis on search and rescue, living marine resources, and law enforcement. The new technology also will augment coastal security, drug and migrant interdiction, ports and waterways protection, and other Coast Guard rapid response needs.
Teledyne FLIR Defense has been delivering and supporting legacy ESS systems for USCG medium- and short-range recovery aircraft since 2005.
“The significant updates through ESS-M will enable the U.S. Coast Guard to stay on technology’s cutting edge while conducting its wide range of key maritime operations,” said Dr. JihFen Lei, president of Teledyne FLIR Defense. “We’re proud to extend our history of support and look forward to building our relationship across all missions areas.”
Share on:
Suggested Items
ASC Sunstone Circuits and Screaming Circuits Partner to Launch Online Assembly Parts Ordering – A New Step Toward Seamless PCB Production
06/23/2025 | ASC SunstoneIn a major step toward simplifying the PCB manufacturing and assembly process, ASC Sunstone Circuits and Screaming Circuits are proud to announce the launch of a new online assembly parts ordering feature, now available through Sunstone.com. This enhanced capability allows customers to source assembly components as part of their PCB order, creating a fully integrated experience from bare board fabrication to finished assembly.
Inventory Headwinds Weigh on Top 5 Enterprise SSD Vendors in 1Q25; Recovery Expected as AI Demand Grows
06/19/2025 | TrendForceTrendForce’s latest investigations reveal that several negative factors weighed on the enterprise SSD market in the first quarter of 2025. These include production challenges for next-gen AI systems and persistent inventory overhang in North America.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.