Indium to Showcase Power Electronics Products at NEPCON Japan

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As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium Corporation will showcase the following among its featured products:

• Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
• Indium8.9HF Solder Paste Series, an industry-proven solder paste series, delivers no-
• clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• Indalloy®301LT  for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
• SiPaste® series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. The series of products helps Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.
• Heat-Spring®, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
• InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.