Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
EDA Tools and the Designer of the Future
January 28, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
We’re seeing new, young technologists moving into the PCB design and design engineering segment, and it’s just in time; many veteran designers are headed to retirement.
At the same time, there have been various recent advances in EDA tools. What will the PCB designer’s job—and the designer’s software tools—look like in the next five years?
Bob Potock, vice president of marketing for Zuken USA, weighs in on the PCB designers of tomorrow, and the EDA tools that will take them into an evermore complex future.
Andy Shaughnessy: I imagine Zuken has a “profile” of its typical user. How do you see this their job and its requirements evolving over the next few years?
Bob Potock: At Zuken, we believe that the PCB design and layout market is evolving. Today’s tools are mature, powerful, and easy to use. However, what's changing in the design process is how the tools are used and by whom. The standard hand-off from the design engineer to the PCB layout designer is becoming a thing of the past. A board with average complexity is more commonly designed, placed, and routed by the same individual: the hardware engineer. The modern hardware engineer will be an electrical engineer who can learn how to do PCB layout on the job. Moderately complex board designs now and in the future will see the traditional PCB layout function moving to the hardware engineer.
The high-complexity PCB market is different. The tools are more powerful, and the designs have more critical requirements. IC packaging may become part of the PCB layout activity at this complexity level. The traditional design engineer hand-off to the PCB layout designer may still exist. However, this modern PCB layout designer is an electrical engineer with training in power integrity, signal integrity, manufacturing, and IC packaging.
To read this entire conversation, which appeared in the January 2025 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Real Time with... IPC APEX EXPO 2025: Uyemura—Inside the Specialty Chemicals Market
04/03/2025 | Real Time with...IPC APEX EXPORich Depoto discusses Uyemura's focus on specialty chemicals and market trends, particularly the shift towards HDI and UHDI products. Rich highlights innovations in surface adhesion and micro etches for copper, essential for high-speed transmission.
CEE PCB Appoints Fred Hickman as Vice President of Sales, North America
04/03/2025 | CEE PCBTom Yang, CEO of CEE PCB, is pleased to announce the appointment of Fred E. Hickman III as Vice President of Sales for North America.