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SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design

01/29/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.

iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection

01/23/2025 | iNEMI
Register today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.

StratEdge Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York

01/22/2025 | StratEdge
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise,

SIA Welcomes Trump Administration

01/22/2025 | SIA
Following this week’s inauguration of President Trump and Vice President Vance, the Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming the new administration.

U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera

01/21/2025 | U.S. Department of Commerce
The U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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