The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
American Made Advocacy: Reshoring—About Trust, Not Just Geography
SEHO to Highlight Cutting-Edge Soldering Technology at IPC APEX Expo 2025
February 17, 2025 | SEHOEstimated reading time: 2 minutes
SEHO, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is thrilled to present its best-selling selective soldering system SEHO SelectLine-C at the IPC APEX Expo 2025 in Anaheim. Join SEHO at booth 849 to explore cutting-edge soldering solutions and automation technology and learn how SEHO is shaping the future of electronics production.
SEHO is continuously developing its product range to create real added value for users. At APEX, the company will highlight the modular inline selective soldering system SelectLine-C. Many innovative ideas are integrated into the SelectLine-C and have made it one of the most successful in the SEHO portfolio.
The SelectLine-C machine concept is consistently modular thus ensuring clear cost benefits. Several modules can individually be configurated with fluxer, preheatings, soldering units, cooling modules, selective brush unit and AOI system. Thus, the SelectLine-C adapts to virtually any manufacturing requirement and if the production conditions should change it may be expanded, the configuration can be modified, or SelectLine-C modules can be shifted to different manufacturing lines at any time.
Starting from a basic module with two soldering units and a total of four workstations, the machine can be expanded to up to six soldering units and more than 15 parallel workstations.
Electro-magnetic soldering units with innovative nozzles for mini-wave and multi-wave soldering processes are part of the standard machine equipment. Maximum throughput requirements are met with the Synchro mode. This intelligent software feature coordinates the soldering process with several soldering units for one assembly type in such a way that the cycle time is nearly halved without the need for significant investment. If different products are manufactured in mixed operation, the SmartSplit mode ensures automatic split of the available soldering units, thus providing maximum throughput rates.
Automatic ultrasonic cleaning of solder nozzles is another highlight in the soldering area. Instead of manual maintenance with aggressive chemicals, the machine cleans the soldering nozzles automatically, gently and in an environmentally friendly manner.
The SelectLine-C is ideally suited for using the LongLife mini-wave solder nozzle. This nozzle type features a lifetime that is at least three times longer than that of conventional nozzles. Therefore, the annual savings potential is remarkable. In addition, maintenance requirements for the LongLife solder nozzles are significantly reduced.
Like all selective soldering systems from SEHO, the SelectLine-C provides a complete hardware and software package for 100% automated process control. The flux quantity monitoring system and gradient-controlled temperature profiles in the preheat area, automatic monitoring of the nitrogen quantity and nitrogen quality, the touchless wave height control or automatic setup control and tool measurement are only some of the monitoring functions that ensure a reliable process.
The SelectLine-C, however, has even more to offer. The machine can be equipped with a selective brush system for automatic removal of solder balls, and an AOI system for automatic inspection of solder joints immediately after the soldering or brushing process. The advantages of these integrated additional processes are obvious. Safe and reliable processes on the one hand and reduced overall production costs on the other hand.
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.