-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
PARMI USA to Unveil Xceed II AOI System at IPC APEX EXPO 2025
February 18, 2025 | PARMI USAEstimated reading time: 1 minute

PARMI USA, INC., a leader in advanced 3D inspection systems, is excited to announce the launch of its next-generation 3D Automated Optical Inspection (AOI) system, the Xceed II, at the 2025 IPC APEX EXPO, scheduled to take place March 18-20, 2025 at the Anaheim Convention Center in Anaheim, California. The Xceed II will be featured at Booth 910, where PARMI will showcase its latest advancements in inspection technology.
The Xceed II features an enhanced platform designed to improve inspection speed and quality. This new system incorporates the TRSC-II sensor, delivering superior 2D/3D data quality and offering five different resolution settings, from high precision (4 µm, 6 µm, 7 µm) for detailed inspection to high-speed settings (10 µm, 14 µm) for faster throughput.
A key highlight of the Xceed II is its optimization for die inspection, including System in Package (SiP), bare die, IPD, die attach, underfill fillet, and Cu Clip on die. This makes it the ideal solution for inspecting complex components found in next-generation electronics. Additionally, the system enhances 2D die inspection through advanced coaxial lighting, enabling more types of defect detection on the die’s top surface, including text, polarity, cracks, contamination, chipping, and epoxy issues.
“We are excited to showcase the Xceed II at IPC APEX EXPO 2025,” said Juan Arango, Head of Sales and Business Development at PARMI USA. “The improvements in speed, precision, and die inspection optimization make the Xceed II the most advanced AOI system for today’s high-demand, high-precision manufacturing environments.”
Visit PARMI USA at Booth 910
PARMI USA invites industry professionals to experience the Xceed II firsthand at Booth 910 during the upcoming IPC APEX EXPO. Attendees will have the opportunity to explore how the Xceed II can enhance inspection efficiency, reduce defects, and improve production processes.
Visit PARMI at IPC APEX EXPO 2025
Attendees at IPC APEX EXPO 2025 are invited to Booth 910 to learn more about the Xceed II and explore how PARMI's inspection solutions can transform their manufacturing processes.
Suggested Items
Collins Aerospace Approved to Begin Full Rate Production of MAPS Gen II system
03/13/2025 | Collins AerospaceCollins Aerospace, an RTX business, has received approval for Full Rate Production of the Mounted Assured Positioning, Navigation and Timing (PNT) Generation II system (MAPS GEN II).
Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.
Pudu Robotics' PUDU T300 Achieves CE-MD and CE-RED Certifications
03/12/2025 | PRNewswirePudu Robotics, a global leader in service robotics sector, announced its innovative industrial delivery robot, the PUDU T300, has obtained both the CE-MD (Machinery Directive) and CE-RED (Radio Equipment Directive) certificates by TÜV SÜD, a world-renowned testing and certification organization.