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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Designing for a More ‘Intelligent’ and Connected Future

09/15/2026 | Marcy LaRont, I-Connect007 Magazine
With more collaborative and computationally demanding PCB designs, cloud-based workflows are rapidly moving from possibility to reality. But greater connectivity also raises new questions about data security, intellectual property, and the sharing of design information in an increasingly complex electronics ecosystem. In this interview, Kristin Moyer of the Global Electronics Association explores the benefits and challenges of cloud-based design environments, the growing importance of standardized data transfer protocols such as IPC-1751 and IPC-2581, and why a secure, intelligent data ecosystem will be essential for the future of co-design, automation, and advanced electronics manufacturing.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.

SEMI, TechSearch International Release 2026 Edition of Worldwide Assembly & Test Facility Database

07/08/2026 | SEMI
SEMI and TechSearch International announced the release of the 2026 edition of the Worldwide Assembly & Test Facility Database, a comprehensive resource tracking semiconductor back-end manufacturing facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) companies worldwide.

The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.

Single Pair Ethernet (SPE): A Valuable Option for Modern Designs

04/20/2026 | Marcy LaRont, I-Connect007
When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
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