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Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award

05/27/2025 | Promex
Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte  has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS).

ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing

05/26/2025 | ClassOne Technology
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.

TRI, Bosch Partner on AI Solution for MEMS Packaging

05/26/2025 | TRI
Test Research, Inc., the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation

05/22/2025 | GlobalFoundries
GlobalFoundries (GF)  announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.

50 Years of productronica: World’s Leading Trade Fair Celebrates Anniversary

05/21/2025 | productronica
When productronica takes place in Munich from November 18 to 21, 2025, a milestone birthday will be on the agenda. The world’s leading trade fair for the development and production of electronics is celebrating its 50th anniversary.
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