It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
IPC Releases Latest List of Standards and Revisions
March 12, 2025 | IPCEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
IPC-7095E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. The standard provides valuable and practical information to those who use or are considering using BGAs, descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrates printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart-molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronics applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
Read about the rest of the standards being released in the Winter 2025 issue of IPC Community.
Share on:
Suggested Items
TCT Circuit Supply and Electra Polymers Announce New Strategic Partnership
03/12/2025 | Electra Polymers LtdTCT Circuit Supply (TCS) is excited to announce a new strategic partnership with Electra Polymers, a global leader in advanced specialty polymer products
LPMS USA Named the Authorized National Distributor for Henkel Printed Electronics Inks and Coatings
03/05/2025 | LPMS USALPMS USA, a leader in low pressure molding solutions, is proud to announce they have been named the authorized national distributor for Henkel printed electronics inks and coatings.
New Book Explores History of X-ray Technology and Application in Electronics Today
03/05/2025 | I-Connect007As the field of electronics continues to evolve, X-ray inspection has become an indispensable tool for ensuring quality and reliability in manufacturing processes. In The Printed Circuit Assembler’s Guide to... X-ray Inspection, author Dr. Bill Cardoso, Creative Electron, discusses the development of contemporary X-ray machines, which incorporate advanced imaging, motion, and decision-making steps that facilitate precise defect detection.
IPC Resources: Working for Your Company
02/24/2025 | Sandy Gentry, IPCAs a global industry-driven organization, IPC exists to help its member-companies and the electronics industry innovate, compete, and succeed. By being the hub of knowledge, IPC provides standards, training and certification, industry intelligence, education, and public policy advocacy to help our industry achieve its goals.
Multilayer PCB Market to Reach $116.1B by 2032 at 5.5% CAGR: Allied Market Research
02/12/2025 | Globe NewswireAccording to the report, the "multilayer printed circuit board market" was valued at $71 billion in 2023, and is estimated to reach $116.1 billion by 2032, growing at a CAGR of 5.5% from 2024 to 2032.