Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
CommScope, Altice Labs Combine PON Technologies to Power Next-Gen FTTH Networks
March 21, 2025 | BUSINESS WIREEstimated reading time: 1 minute
CommScope, a global leader in network connectivity, announced the availability of its PON Evo™ products, a comprehensive suite of passive optical network (PON) active optical line terminal (OLT) solutions. The PON Evo suite is the result of a strategic partnership with Altice Labs, a leading R&D company, specializing in advanced telecommunications solutions.
CommScope’s PON Evo suite of products and vBNG Evo™ solution support a comprehensive, managed and orchestrated network transition strategy under a unified architecture. CommScope is integrating the Altice Labs line of advanced OLTs, software-defined network (SDN) management, and operational and business support systems into its existing portfolio.
As average revenue per user (ARPU) continues to decline, these benefits can facilitate migration from GPON to XGS-PON, and even 50G PON, all on the same infrastructure, with the integration of Altice Labs’ dual density XGS-PON SFP and dual XGS-PON SFP+ solutions, which significantly increases PON port density.
“By combining our existing virtual broadband network gateway (vBNG) and remote OLT solutions with Altice Labs’ technologies, we are now positioned to deliver a comprehensive and competitive FTTH portfolio giving our customers a single-source partner,” stated Guy Sucharczuk, SVP and president, Access Network Solutions, CommScope. “This expanded ecosystem is designed to meet the evolving needs of our customers as they deploy next-generation FTTH networks. These innovative PON solutions also expand upon our portfolio of hybrid fiber coax (HFC) solutions for customers who are implementing targeted FTTH deployments.”
“CommScope’s vBNG Evo solution is an excellent complement to our xPON technology,” said Joao Paulo Firmeza, general manager of Altice Labs. “This is a great mutually relevant collaboration whereby our offering is expanded with CommScope technologies, and they can now offer a full PON portfolio with the addition of Altice Labs’ technology. Together we create a formidable partnership aligned to meet our customers’ needs.”
Share on:
Suggested Items
Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years
06/26/2025 | Count On ToolsCount On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
06/26/2025 | ECTCThe 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.