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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics

05/07/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.

DuPont Exceeds Quarterly Profit Expectations as Electronics Segment Benefits from Semiconductor Demand

05/05/2025 | I-Connect007 Editorial Team
DuPont reported higher-than-expected earnings for the first quarter of 2025, supported by increased demand in its electronics and industrial segments. The company’s adjusted earnings per share came in at 79 cents, surpassing the average analyst estimate of 65 cents per share, according to data from LSEG.

Schweizer Electronic Publishes Group Figures for 2024 and Provides Outlook for 2025

05/01/2025 | Schweizer Electronic AG
SCHWEIZER achieved a turnover of EUR 144.5 million in the 2024 financial year (previous year: EUR 139.4 million), the highest consolidated turnover in the company's history.

Kasuo Electronics Launches Advanced Testing Laboratory to Strengthen Global Supply Chain Quality Assurance

04/29/2025 | BUSINESS WIRE
Kasuo Electronics Co., Ltd, a globally recognized trader of electronic components, has officially operationalized its state-of-the-art testing laboratory.

DuPont Announces Additional Leaders and Company Name for the Intended Spin-Off of the Electronics Business

04/29/2025 | PRNewswire
DuPont announced Qnity Electronics, Inc. as the name of the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business.
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