IDC: Semiconductor Foundry 2.0 Market is Entering the Growth Phase from Recovery with 11% YoY Growth in 2025
March 24, 2025 | IDCEstimated reading time: 2 minutes
According to IDC ’s Worldwide Semiconductor Supply Chain Tracking Intelligence latest report, the global semiconductor market, following a recovery in 2024, is expected to experience steady growth in 2025. The broadly defined Foundry 2.0 market— encompassing foundry, non-memory IDM, OSAT, and photomask making—is projected to reach a market size of $298 billion in 2025, with year-over-year growth of 11%, signaling a transition from a recovery phase in 2024 to a growth phase in 2025. Over the long term, the compound annual growth rate (CAGR) from 2024 to 2029 is projected to reach 10%. This growth is catalyzed by the continuous rise in AI demand and a gradual recovery in non-AI demand.
The foundry sector remains the core driver of semiconductor manufacturing. Industry leader TSMC (Taiwan Semiconductor Manufacturing Company) leverages its technological edge in advanced nodes below 5nm and advanced packaging CoWoS, securing robust orders for AI accelerator manufacturing. With utilization consistently at full load, TSMC is expected to expand its market share in the Foundry 2.0 market to 37% in 2025.
While other foundry manufacturers face pressure from price erosion in mature nodes, the rebound in demand for consumer electronics—such as smartphones, PCs, notebooks, TVs, and wearables—has driven a projected 4% average increase in utilization for mature nodes. This resurgence fuels a significant expansion of the overall foundry market, expected to grow by 18% in 2025.
Non-Memory IDM Faces Challenges
The non-memory IDM (Integrated Device Manufacturer) sector, hampered by insufficient deployment in AI accelerators, will experience limited expansion in 2025. Intel is aggressively promoting its process technologies, particularly the 18A process alongside Intel 3/Intel 4 processes, which are anticipated to maintain its market share in the Foundry 2.0 market at approximately 6%.
Meanwhile, IDM specializing in automotive and industrial sectors—such as Infineon, Texas Instruments, STMicroelectronics, and NXP—have completed inventory adjustments. However, market demand is expected to remain weak in the first half of 2025, with stabilization projected for the second half. Collectively, these factors limit the overall non-memory IDM sector to a modest growth of 2% in 2025.
OSAT Welcomes AI-Driven Growth
The Outsourced Semiconductor Assembly and Test (OSAT) sector is benefiting from IDMs increasing outsourcing to foundry due to advanced nodes demands, shifting packaging and testing needs to OSAT vendors. While traditional packaging and testing businesses remain lukewarm, the strong demand for AI accelerators has spurred a rise in advanced packaging orders. Vendors such as SPIL (under ASE), Amkor, and KYEC are actively taking on more CoWoS-related orders, collectively driving the overall OSAT industry to an expected growth of 8% in 2025.
“The semiconductor manufacturing chain is entering a new wave of expansion. AI continues to drive demand for advanced nodes and advanced packaging, while traditional application markets gradually recover, presenting the industry with diversified development opportunities,” said Galen Zeng, senior research manager at IDC Asia/Pacific. “However, the industry must navigate multiple variables, including geopolitical risks, national policies (such as China’s consumption stimulus measures, U.S. factory construction subsidies, and potential U.S. chip tariffs), supply-demand fluctuations from new capacity, and the commercialization progress of AI applications. These factors will shape the long-term development trajectory of the semiconductor industry."
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/18/2025 | Andy Shaughnessy, Design007 MagazineIt’s been a busy week in our industry. Never a dull moment! If you’ve been paying attention to our tariff tumult with China and its effect on the stock market, especially if your company does a lot of business with China, you might be tempted to call in a Xanax refill about now. But hang tight. This is still early in the first quarter. This brouhaha serves to underscore our need to manufacture critical laminates and components in the U.S. In this week’s must-reads, we have a potpourri of articles covering tariffs, the next generation of HDI, the three-year anniversary of IPC Mexico, a novel green technology, and emerging design trends.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.