Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Electronics in Harsh Environments Conference Program Announced
March 25, 2025 | SMTAEstimated reading time: Less than a minute
SMTA Europe is proud to announce the 2025 Electronics in Harsh Environments Conference, taking place 20-22 May in Amsterdam, Netherlands. This global conference is a three-day technical event with 27 technical presentations focused on building reliable electronics used in power electronics and harsh environments.
Session Topics Include:
- Harsh Environmental Reliability Conditions
- Testing & Cleanliness Validation
- Protective Coatings - Materials & Processes
- Testing of Coatings
- Reliability in Humid Environments - Failure Mechanisms
- Advanced Materials and Processes
- Interconnection Technologies - Materials, Processes & Validation Methods
- Particle Cleanliness & Particle Risk Assessment
The opening keynote speaker, Lothar Henneken, Ph.D., Robert Bosch GmbH, will present “Testing, Validation, Qualification for Automotive Electronics” on Tuesday, 20 May at 9:00am.
Following the keynote, a two-part professional development course will be instructed by Stefan Schmitt, SemikronDanfoss. The first part, titled “Robustness Validation vs. Qualification for Power Modules” will be followed by part two, titled “Challenges and Requirements for Harsh Environmental Power Module Testing.”
Registration is available online with early registration pricing in effect until 21 April 2025.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.
IPC APEX EXPO 2025 Review: The New Normal Looks Like the Old Normal
04/16/2025 | Nolan Johnson, SMT007 MagazineAt IPC APEX EXPO, my days are filled with either talking or listening from sunup to sundown. I get to answer questions of some of the brightest minds in the business, while also listening and synthesizing what they’re sharing with me about the current and future state of the industry. Here are five observations based on the conversations.