Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
March 26, 2025 | Indium CorporationEstimated reading time: 2 minutes
As a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
With 10 years of expertise in EV manufacturing and more than 10 million electric vehicles using its advanced materials, Indium Corporation will showcase its Rel-ion™ product suite. These products offer reliable electrical, mechanical, and thermal solutions designed to accelerate manufacturers’ time to market. Rel-ion™ material solutions enhance reliability by:
- Eliminating non-wet opens and head-in-pillow defects
- Preventing dendritic growth by meeting stricter surface insulation resistance requirements
- Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
- Reducing hot spots-induced voiding through improved thermal efficiency
Indium Corporation will focus on the following featured products:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
In addition, Indium Corporation will showcase the following products of high-reliability materials powering sustainability:
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
- Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.
- InFORCE™ is a series of high-reliability pressure sinter pastes, offering copper and silver formulations with excellent thermal conductivity. Optimized for printing, large-area sintering, and low-temperature processing, they offer innovative solutions for advanced die-attach and package applications.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference
07/31/2025 | MAGNALYTIXMagnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects of Flux Residues and Process Contamination on the Reliability of the Electronic Assembly” on Wednesday, Aug. 13 at 9:00 AM CST to open the second day of the STMA High-Reliability Cleaning and Conformal Coating Conference.
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven
08/01/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation.
KYZEN Cleaning Experts to Provide Insights at SMTA High Reliability Cleaning and Coating Conference
07/29/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that three members of the KYZEN team of cleaning experts will present technical presentations as part of KYZEN’s participation at the 2025 SMTA High Reliability Cleaning and Conformal Coating Conference scheduled to take place Aug. 12-14, 2025 at the Westin DFW Airport.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.