IPC APEX EXPO 2025 Review: Shifting My Focus to the Show Floor
April 2, 2025 | John Watson, CIDEstimated reading time: 3 minutes
IPC APEX EXPO 2025 marked a significant milestone as it celebrated its 25th anniversary. (Personally, I don’t think it looked a day over 20.) If you didn’t attend this great event, why not? This was my 10th anniversary of attending, and it had a distinctly different feel. There was a celebratory atmosphere as both veterans, like myself, and first-time attendees, were drawn into a celebratory occasion marking the significant milestone of the 25th anniversary.
But more than that, I felt that through the various battles of those 25 years, our industry was turning a corner. Before entering the Anaheim Convention Center, you could look up and see a giant banner on the front of the building declaring, “Imagine the Possibilities.” It wasn’t just a cute adage, but for myself and many of you, it took on a deeper meaning as a challenge. I knew then that this would be a unique event. It did not disappoint.
From the exhibit halls to the technical presentations, throughout the whole convention, the “buzzword” for everyone was AI. Leading the charge on that topic was the Design Leadership Council's Town Hall meeting on AI discussing precisely how this new technology could impact our industry and how our jobs will change in the future. Fascinating discussion with the panel and audience.
Because of my new role in the industry, my focus this year was slightly different from that in years past. This time my focus was on the exhibition floor, a bustling hub of activity featuring over 400 exhibitors. The one that stood out for me was Elephantech, headquartered in Tokyo, Japan, which showcased utilizing newly developed copper nanoparticle ink and primer technology for rigid and flex PCBs. This advancement provides enhanced adhesion on various substrates and offers potential applications in advanced PCBs and printed electronics, addressing environmental concerns and promoting more efficient manufacturing processes. Additionally, the copper nanoparticle ink enables the direct printing of PCB traces, resulting in reduced waste compared to traditional subtractive etching methods. It's amazing.
Additionally, I was interested in the new IPC Learning Lounge, a designated area on the show floor where attendees could learn about electronics manufacturing. It offered free sessions where experts shared valuable tips and innovative ideas. Visitors could learn about training programs, new PCB design methods, and techniques to improve manufacturing efficiency.
One thing I missed and was frankly disappointed by was not having the PCB design challenge. In years past, it was a great way for engineers and students to showcase their design skills. The challenge was also an opportunity for new designers to get noticed, so skipping it might make it harder for beginners to showcase their talent. I hope this is not a sign of an IPC shift in focus away from the design side of the industry. I hope it will return in the future, possibly with new vigor and purpose.
Maybe the real excitement of IPC APEX EXPO wasn’t the obvious but something more. As Albert Einstein once said, “Imagination is more important than knowledge. For knowledge is limited to all we now know and understand, while imagination embraces the entire world, and all there ever will be to know and understand.”
This reminds us that the power of imagination can take us beyond what we know today and help us create the future. Imagine the possibilities when we use our creativity to solve problems, invent new things, and push the boundaries of what’s possible. The world is full of endless opportunities, and with a bit of imagination, anything is possible.
John Watson is a professor at Palomar College, San Marcos, California and an I-Connect007 columnist. To read past columns, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).