CEE PCB Appoints Markus Voeltz to Business Development Director Europe
April 2, 2025 | CEE PCBEstimated reading time: 1 minute

CEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and began providing local support in March 2025. With 25 years of experience in the industry, the company is enhancing its commitment to European customers by providing more direct collaboration for technical inquiries and advice.
Markus Voeltz, an experienced sales professional with over 20 years of experience in the PCB/FPC and EMS industries, will head the new European branch. He will be the direct contact for customers and prospects across various industries, offering tailored solutions and support.
CEE PCB is known for its comprehensive product range, which includes multilayer PCBs with up to 30 layers, HDI PCBs, and flexible printed circuits. The company delivers high quality solutions for a wide range of applications, from prototype development to mass production. Notably, CEE PCB is highly flexible and able to handle both small and medium batch sizes efficiently.
The company is certified not only to ISO 9001 but also to the demanding standards of IATF 16949 and ISO 13485, which are particularly important in the automotive and medical technology sectors. These certifications ensure a robust quality management system that meets the highest industrial standards.
“The decision to offer direct support in Europe is another step toward serving our customers even faster and more effectively,” says Tom Yang, CEO of CEE PCB. “Our long-standing experience and extensive product portfolio, combined with our local presence, allow us to address the specific needs of our customers more directly.”
With this expansion, CEE PCB reinforces its ambitions to strengthen its market position as a reliable partner for PCB and FPC solutions while enhancing its proximity to European customers.
Suggested Items
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
04/30/2025 | ElephantechJapanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing.
Ensuring a Strong and Reliable Supply Chain
04/30/2025 | Marcy LaRont, PCB007 MagazineKelly Davidson, vice president of NCAB Group USA, discusses the company's stable performance in 2024 and positive outlook for 2025. She highlights NCAB's strategy of organic growth and strategic acquisitions amidst tariff concerns and global political uncertainty. Kelly emphasizes the importance of supply chain diversification, strong supplier relationships, and customer education, and notes NCAB's focus on defense production and maintaining a reliable supply chain.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
04/29/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
DuPont Announces Additional Leaders and Company Name for the Intended Spin-Off of the Electronics Business
04/29/2025 | PRNewswireDuPont announced Qnity Electronics, Inc. as the name of the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business.
New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.